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Silver dipping process of MLCC
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Product: Views:219Silver dipping process of MLCC 
Unit price: Negotiable
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Delivery date: Since the payment date Days delivery
Valid until: Long-term effective
Last updated: 2017-07-09 18:01
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Details
Model Number: GTG225 Key Specifications/Special Features: Silver dipping process of MLCCSplicing for release paperPlate masking on PCBFor powder coating process on PCBPet film: 25Total thickness: 50Adhesion(kg/25mm): over 0.6
  • Unwinding force (g/25mm): under 600
  • Temp: 180°C
    • Shipping Information:
    • FOB Port: Taiwan
    Main Export Markets:
    • Mid East/Africa
    • North America
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